madbeatzyo111 wrote:Wow this is starting to get very sophisticated, what with all the hydrodynamic wave-guided airflow quantum bubble wrap tunneling...ok maybe not so much the quantum part

well, I'm currently on the way to construct the formula
madbeatzyo111 wrote:I see some issues with trying to do it with tubing--namely there not being enough space inside. Instead I would suggest using baffles (think ailerons on an airplane wing) to guide the airflow where you want it, and reduce airflow to areas you don't need it by stuffing with glass wool or something similar.
I think baffles wouldn't work, because the air flow isn't that speedy.
Generally it would be ideal to separate the whole chassis into two halfs (rear and front side), with connections only at the ends (motherboard and the opposite end). The hot air should be directly transfered to the cool end and the cooled air floating back the other way.
There shouldn't be a leak, between both ways, because the hot air could float back before cooled.
You would ideally have to install a long wall from the left to the right with no leak. This is difficult because of all those electronic parts.
Instead, a pipe from the motherboard to the other end perfectly separates the forward and backward flow without any possibility for a short circuit.
However as you said, the space for the pipe is limited.
I think a pipe with a diameter equal to the fan should be enough, so 60x60 (inner dimensions) should be good.
The main problem here is to get around the SSD mount. The straight way is not possible.
However, using a pipe would also allow to take a way between SSD and keyboard.